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2008 ASM AB 559A Automatic Bonding and Rework Machine
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- Status
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Lot specifications
- Quantity
- 1
- Margin
- No
- Brand
- ASM
- Type
- AB 559A
- Year of build
- 2008
- Serial number
- 59A-32-654
- Manual present
- Yes
- Electric connection
- 230V
- Own weight
- 480kg
- Total dimension L
- 760mm
- Total dimension W
- 800mm
- Total dimension Height
- 2030mm
Description
ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie designed for the multi-point connection of large-scale integrated circuit chips. The device offers a range of features and capabilities that make it suitable for a variety of microelectronic chip assembly applications. Wedge bonder, bond head 60°, 10 bar (145 psi), Supplied pressure 5 bar (72.5 psi), Air consumption 63 1/min (2.2 cfm), Rating: 15A-125V, 1875 Watts, SVT Beldfoil shielded, AWG Stranding: 14 (41x30), Diameter1.91 mm, 230 VAC (Single phase) ± 5%, Frequency 50/60 Hz, Power consumption 800 W
Additional details
There is no right of withdrawal.
The minimum age for visiting the viewing and collection days is 18 years. Visitors must be able to identify themselves.
During the collection day, a forklift with driver is available, which can be used free of charge. The maximum lifting capacity is 2.5 tonnes.
Use of the forklift truck is entirely at your own risk. In addition, waiting times may occur.
The minimum age for visiting the viewing and collection days is 18 years. Visitors must be able to identify themselves.
During the collection day, a forklift with driver is available, which can be used free of charge. The maximum lifting capacity is 2.5 tonnes.
Use of the forklift truck is entirely at your own risk. In addition, waiting times may occur.
